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APX9267
Single-Phase Full-Wave Motor Driver for Silent Fan Motor Features
* * * * * * * * * *
Single Phase Full Wave Fan Driver Silent Driver Low Supply Current Low Standby Current (Lock mode TOFF or PWM=0 duty), Supply current less than 220A Speed Controllable by PWM Input Signal Built-in Quick Start Function Lock Protection and Auto Restart Function Built-in FG Output Built-in Thermal Protection Circuit Lead Free and Green Devices Available (RoHS Compliant)
General Description
The APX9267 is a single phase full wave motor driver for DC fan motor, and speed controlled by PWM input signal. The output signal of this IC is the amplified hall input signal. It is suitable for both game machine and CPU cooler that need silent drivers. The device is built-in lock protection. When fan is locked, the device will enter the lockup protection mode. It is also with thermal shutdown function. In normal operation, supply current is less than 5mA, but in PWM=0 standby mode, it is just around 150mA. Moreover, this feature will shutdown Amplifier and FG. The APX9267 is available in MSOP-8 package.
Pin Configuration
OUT2 VCC IN+ IN1 2 3 4 8 7 6 5 GND OUT1 PWM FG
Applications
*
Motor Drivers For Silent Fan Motors
MSOP-8
Ordering and Marking Information
APX9267 Assembly Material Handling Code Temperature Range Package Code
A9267 XXX XX
Package Code X : MSOP-8 Operating Ambient Temperature Range I : -40 to 105 C Handling Code TR : Tape & Reel Assembly Material L : Lead Free Device G :Halogen and Lead Free Device XXXXX - Date Code
APX9267 X :
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish;which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature.ANPEC defines "Green" to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).
Absolute Maximum Ratings (Note 1)
Symbol VCC IOUT VOUT VFG IFG VCC Pin Supply Voltage Output Pin Output Current Output Pin Output Voltage FG Pin Output Voltage FG Pin Sink Current
Parameter
Rating 7 1 7 7 10
Unit V A V V mA
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright (c) ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 1 www.anpec.com.tw
APX9267
Absolute Maximum Ratings (Cont.)
Symbol RTH, JA PD TJ TSTG TSDR Parameter Thermal Resistance-Junction to Ambient MSOP-8 Power Dissipation Junction Temperature Storage Temperature Maximum Lead Soldering Temperature, 10 Seconds Rating 225 0.585 -40 to 150 -65 to 150 260 Unit C/W W C C C
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Recommended Operating Conditions
Symbol VCC VHall TA VCC Pin Supply Voltage Hall Input Voltage Range Ambient Temperature Parameter Rating 2.3 to 5.5 0.2 to Vcc-1.1 -40 to 105 Unit V V C
Electrical Characteristics
Symbol ICC1 ICC2 VPWMH VPWML FPWM VHOFS GIO VOL VOH VFG IFG Parameter Operating Current Standby Supply Current PWM Input High Level Voltage PWM Input Low Level Voltage PWM Input Frequency Input Offset Voltage Input-Output Gain Output Lower Side Saturation Output Upper Side Saturation FG Pin Low Voltage FG Pin Leak Current Over Temperature Shutdown Over Temperature Shutdown Hysteresis TQS Quick Start Enable Time
(VCC=5V, TA= 25C, unless otherwise specified)
Test Conditions Rotation Mode Lock Protect TOFF or PWM= 0 APX9267 Min. 2.5 0 0.02 VOUT/H+-H-(ratio) IOUT= 250mA IOUT= 250mA IFG= 3mA VFG= 5V 45 Typ. 3 150 48 0.15 0.15 0.2 170 35 66.5 Max. 5 220 VCC+0.5 1 50 6 51 0.22 0.22 0.3 10 90 C mSec Unit mA A V V kHz mV dB V V V A
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APX9267
Typical Operating Characteristics
VCC Supply Current vs. VCC Supply Voltage
4
Operation Mode
VCC Supply Current vs. VCC Supply Voltage
250
Standby Mode
3.5
VCC Supply Current (mA)
3 2.5 2 1.5 1 0.5 0 0 1 2 3 4 5 6 7
VCC Supply Current (A)
200
150
100
50
0 0 1 2 3 4 5 6 7
VCC Supply Voltage (V)
VCC Supply Voltage (V)
FG Pin Current vs. FG Pin Low Voltage 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1
FG Pin Low Voltage (V)
Offset Voltage vs. Ambient Temperature 1.4 1.2
Offset Voltage (mV)
FG Pin Current (mA)
1 0.8 0.6 0.4 0.2 0 -40 -20 0 20 40 60 80
Ambient Temperature (C)
Saturation Voltage vs. Output Current
0.8 0.7
Maximum Power Dissipation vs. Ambient Temperature
Maximum Power Dissipation (mW)
700 600 500 400 300 200 100 0
Saturation Voltage (V)
0.6 0.5 0.4 0.3 0.2 0.1 0 0 100 200 300 400 500 600 700 800
Low Side MOSFET Upper Side MOSFET
0
25
50
75
100
125
150
Output Current (mA) Copyright (c) ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 3
Ambient Temperature (C) www.anpec.com.tw
APX9267
Operating Waveforms
Rotation Waveform 1 VIN+ (50mV/div) VIN(50mV/div) Rotation Waveform 2 VIN+ (50mV/div) VIN(50mV/div)
VOUT1 (2V/div)
VOUT2 (2V/div)
VOUT1 (2V/div)
VOUT2 (2V/div)
Time (0.2ms/div)
Time (0.2ms/div)
Rotation Waveform 3
Rotation Waveform 4 IIN (100mA/div)
IIN (100mA/div) VOUT1 (5V/div) VOUT2 (5V/div) VFG (5V/div) Time (0.2ms/div) Lock Protection Waveform 2 VOUT1 (5V/div)
VOUT2 (5V/div) VFG (5V/div) Time (2ms/div) Lock Protection Waveform 1
IOUT (200mA/div) VOUT1 (5V/div) VOUT2 (5V/div)
IOUT (200mA/div) VOUT1 (5V/div) VOUT2 (5V/div)
VFG (5V/div) Time (2s/div)
VFG (5V/div) Time (2s/div)
Copyright (c) ANPEC Electronics Corp. Rev. A.6 - Mar., 2008
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APX9267
Pin Description
PIN No. 1 2 3 4 5 6 7 8 Name OUT2 VCC IN+ INFG PWM OUT1 GND H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. Supply Voltage Input Pin. Hall Input +. Hall Input -. Rotation Speed Output. PWM Signal Input Terminal. H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. Ground. Description
Block Diagram
OUT2
150 500
GND
VCC

Vcc
OUT1
5A
TSD
IN+
500
Control
90K
PWM
10k
150
FG
IN-
Copyright (c) ANPEC Electronics Corp. Rev. A.6 - Mar., 2008
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APX9267
Typical Application Circuit
1 Zener D2 2 C1 6V 3
OUT2
GND
8
D1 VIN
VCC
OUT1
7 PWM control signal
Hall
IN+
PWM
6
10k 4 INFG 5 RFG
Pull High Voltage
FG Output Note 2: In hot plug application, it' necessary to protect against a hot plug input voltage overshoot. Add an input zener diode, between s the VCC and GND, to clamp the overshoot. In normal operation diode, the zener diode isn' stressed because output current t doesn' reverse to VCC. t
Function Description
Lockup Protection and Automatic Restart This IC detects the rotation of the motor by hall signal, and adjusts lock detection ON time (TON) and lock detection OFF time (TOFF) by internal counter. These times (TON, TOFF) are showed below.
IN+ IN-
Quick Start and Standby mode This IC would enter standby mode when the PWM input keeps low level for more than 66.5ms (typ.). In standby mode, it will shutdown amplifier and FG. Thus, the supply current is around 150A. In standby mode, the lock protection function doesn' work, therefore, starting fan is t unobstructed when releasing standby mode.
OUT2
TOFF
TOFF
PWM 66.5ms (typ.)
TON OUT1
Lock protect enable (internal)
enable
disable
enable
Figure 2. Quick Start Waveform
FG
Frequency Generator Function
Lock Lock Detection Release Reset
The FG pin is an open collector output, connecting a pull up resistor to a high level voltage for the frequency gen-
Figure 1. Lock Protection and Automatic Protection Waveform
Copyright (c) ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 6
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APX9267
Function Description (Cont.)
Frequency Generator Function (Cont.) erator function. During the Lock Mode, the FG will be always high (switch off) (See Truth Table). Open the terminal when not in using. Thermal Protection The APX9267 has thermal protection, when internal junction temperature reaches 170C, the output devices will be switched off. When the IC' junction temperature s cools by 35C, the thermal sensor will turn the output devices on again, resulting in a pulsed output during continuous thermal protection.
Truth Table
Input INL H H L L H IN+ H L L H H L PWM H OUT1 H L L L L L OFF Output OUT2 L H L L L L OFF FG L OFF OFF L OFF OFF OFF Lock Mode Standby Mode Operation Mode Mode
L
L
Application Information
Input Protection Diode & Capacitor The APX9267 should be added a protection diode (D1) to protect the damage from the power reverse connection. However, the protection diode will cause a voltage drop on the supply voltage. The current rating of the diode must be greater than the maximum output current. For the noise reduction purpose, a capacitor (C1) 1F is connected between VCC and GND (See Typical Application Circuit). Hall input Please adjust hall input voltage by value of resistance so that hall signal contains amplitude input within range GND~VCC -1.1. The output signal of this IC is the amplified hall input signal, therefore, the output signal depends on hall input. When the hall input is small, the output signal becomes gentle. Oppositely, when the input signal is large, the output becomes steep (See Figure 3. Differences of output signal depending on the shape of hall input signal) .The input/output gain is 48dB (typ.). Thus, please adjust the amplitude of hall input to meet the adequate output voltage.
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OUT1 (IN+)-(IN-) OUT1 (IN+)-(IN-)
Figure 3. Differences of Output Signal Depending on the Shape of Hall Input Signal
APX9267
Application Information (Cont.)
PWM input It is possible to change rotation speed of the motor by switching high side output transistor. The on-duty of switching depends on the input signal to PWM terminal. (See Figure 4. PWM Input Waveform) The value of resistor in the range of 1k to 10k is recommended. Thermal Consideration Refer to "Maximum Power Dissipation vs. Ambient Temperature", the IC is safe to operate below the curve and it will cause the thermal protection if the operating area is above the line. For example, T A = 75C, the maximum power dissipation is about 0.35W. The power dissipation can be calculated by the following equation: PD = (VCC - |VOUT1 - VOUT2|) x IOUT + VCC x ICC
PWM
IN+
For example: VCC = 5V, ICC = 4mA, IOUT = 270mA, VOUT1 = 4.83V, VOUT2 = 0.17V, then PD = 0.111W
OUT1
The GND pin provides an electrical connection to ground and channeling heat away. The printed circuit board (PCB) forms a heat sink and dissipates most of the heat into ambient air.
OUT2
FG
Figure 4. PWM Input Waveform The input level of PWM terminal is H : High side output transistor is ON L : High side output transistor is OFF When PWM terminal is open, it is equal to H. FG Resistor The value of the FG resistor could be decided by the following equation:
- RFG = V CC V FG IFG For example:
VCC=5V, IFG=3mA, VFG=0.2V, RFG=1.6k
Copyright (c) ANPEC Electronics Corp. Rev. A.6 - Mar., 2008
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APX9267
Package Information
MSOP-8
D
SEE VIEW A
E1 e b
E
c
A2
0.25 VIEW A MSOP-8 INCHES MIN. MAX. 0.043 0.000 0.030 0.009 0.003 0.114 0.185 0.114 0.026 BSC 0.80 8 0.016 0 0.031 8 0.006 0.037 0.015 0.009 0.122 0.201 0.122 MAX. 1.10 0.15 0.95 0.38 0.23 3.10 5.10 3.10
A
A1
S Y M B O L A A1 A2 b c D E E1 e L 0
MILLIMETERS MIN.
0.00 0.75 0.22 0.08 2.90 4.70 2.90 0.65 BSC 0.40 0
Note: 1. Follow JEDEC MO-187 AA. 2. Dimension Ddoes not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension E1does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 5 mil per side.
Copyright (c) ANPEC Electronics Corp. Rev. A.6 - Mar., 2008
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0
L
GAUGE PLANE SEATING PLANE
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APX9267
Carrier Tape & Reel Dimensions
OD0 P0 P2 P1 A E1 F K0 B SECTION A-A T B0 A0 OD1 B A SECTION B-B
d
Application
MSOP- 8
T1 C d 12.4+2.00 13.0+0.50 330.0O .00 50 MIN. 2 1.5 MIN. -0.00 -0.20 P0 P1 P2 D0 D1 1.5+0.10 4.00O .10 8.00O .10 2.00O .10 0 0 0 1.5 MIN. -0.00
A
H
H A
T1
D
W
E1
W
F 5.5O .10 0
0 0 20.2 MIN. 12.0O .30 1.75O .10
T A0 B0 K0 0.6+0.00 6.70O .20 3.30O .20 1.40O .20 0 0 0 -0.40 (mm)
Devices Per Unit
Package Type MSOP- 8 Unit Tape & Reel Quantity 3000
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APX9267
Reflow Condition
TP
(IR/Convection or VPR Reflow)
tp Critical Zone TL to TP Ramp-up
TL
Temperature
tL Tsmax
Tsmin Ramp-down ts Preheat
25
t 25C to Peak
Reliability Test Program
Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B,A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78
Time
Description 245C, 5 sec 1000 Hrs Bias @125C 168 Hrs, 100%RH, 121C -65C~150C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1tr > 100mA
Classification Reflow Profiles
Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5C of actual Peak Temperature (tp) Ramp-down Rate Time 25C to Peak Temperature Sn-Pb Eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds See table 1 10-30 seconds 6C/second max. 6 minutes max. Pb-Free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds See table 2 20-40 seconds 6C/second max. 8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
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APX9267
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process - Package Peak Reflow Temperatures Package Thickness <2.5 mm 2.5 mm Volume mm <350 240 +0/-5C 225 +0/-5C
3
Volume mm 350 225 +0/-5C 225 +0/-5C
3
Table 2. Pb-free Process - Package Classification Reflow Temperatures Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0C* 260 +0C* 260 +0C* 1.6 mm - 2.5 mm 260 +0C* 250 +0C* 245 +0C* 2.5 mm 250 +0C* 245 +0C* 245 +0C* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0C. For example 260C+0C) at the rated MSL level. Package Thickness
3 3 3
Customer Service
Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838
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